CDNBS08-SLVU2.8-8

The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Transient Voltage Suppressor Array combination diodes for surge and ESD protection applications in an eight lead narrow body SOIC package size format. Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their fl at confi guration minimizes roll away. The Bourns device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC61000-4-5 (Surge) requirements.

• Protects up to four I/O ports
• Bidirectional confi guration
• ESD protection
• Low capacitance: 6 pF