ENW89848AVKF

The PAN1761 is based on Toshiba's single chip TC35670 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.1 LE stack, GATT profile and a NFC Forum Type 3 compliant NFC tag. Peak power consumption of only 5.8 mA in Tx mode allows advanced wireless functionali- ties in IoT, medical, and industrial applications without compromising battery life. Additionally NFC allows products to wake up from zero standby power consumption to full Bluetooth operation. Furthermore NFC allows the exchange of Bluetooth security credentials enabling highly secure Bluetooth connections. The PAN1761 can either be operated in Hosted mode for very simple integration of Bluetooth connectivity into existing products, or in Stand- Alone mode, where 24 kB RAM is available for the user application. The PAN1761 and the PAN1026 share the same footprint. When migrating from PAN1026 only minor code changes are required. Previously developed software (Bluetooth Low Energy profiles and applications) can be ea

• Bluetooth Low Energy (BLE) 4.1 compliant
• NFC Forum Type 3 compliant NFC tag (external antenna)
• Almost zero power consumption in standby mode by using NFC wake up
• 512 kbit EEPROM memory
• Small 15.6 mm x 8.7 mm x 1.9 mm SMD module
• Support for Scatternet/Mesh network
• UART, I2C & SPI interface, PWM output (3x), ADC (3x), 10 programmable I/O
• Operating temperature range -30 °C to +85 °C
• Operating temperature range -30 °C to +85 °C