MINIOVEN 04 S

The MINIOVEN 04 S is a Reballer, designed for Reballing Area Array devices such as BGAs and CSPs along with Prebumping leadless components including QFNs and other surface mount devices. Additionally the Mini-Oven is used to reflow small form factor assemblies and other thermal applications. It provides extremely uniform heating necessary for simultaneous reflow of large area array components. The integrated processor provides closed-loop thermal control via feedback from a strategically positioned process thermocouple. Up to 99 different heating recipes/profiles can be taught and stored. The Mini-Oven is also available with optional Process Gas Inlet. Use of a nitrogen atmosphere during reflow promotes improved wetting by displacing oxygen and minimizing further oxidation. Reballing and Prebumping tooling is readily available for most standard SMD components.